Sale!

Universal Mobile Phone Cooling Fan Radiator Semiconductor Phone Cooler Game Mini Cool Heat Sink For IPhone Samsung Xiaomi

$1.52

SKU: 3256804255276205 Category:

Description

Universal Mobile Phone Cooling Fan Radiator Semiconductor Phone Cooler Game Mini Cool Heat Sink For IPhone Samsung Xiaomi

Description:

Product Specifications.

Product name: Composite uniform heat plate

Product size: 60*106*28mm

Product category: models (with semiconductor cooling back clip use, back material conductive silicon paper)

Magnetic (universal magnetic models and back clip models heat sink use, back of the material double-sided adhesive)

How to use: Attach to the back of the phone, with the use of heat sink, increase the heat dissipation area, to achieve the phone CPU and camera cooling.

The magnetic absorbing product is embedded inside the magnetic sheet, seamlessly pasted, the magnetic absorbing radiator can be directly adsorbed to use.

Specifications:

Feature:

[Mobile phone composite even heat plate] fast cooling uniform heat dissipation, increase the heat dissipation area, accelerate the speed of heat dissipation.

[Semiconductor cooling & large area heat sink] for cell phone hot spots, using a large area even heat sink, rapid neutralization of heat to achieve uniform heat dissipation effect.

[Strong adhesive – not fall off] strong adhesive, firmly adsorbed, no need to worry about radiator fall.

[Thin and light experience] The thickness is only 1mm, closely fit the phone.

[With silicone protection, do not hurt the phone] easy to take and easy to paste, with silicone protection, soft and do not hurt the machine.

Package Included:

1×Heat sink area increase plate

 

Additional information

color

Silver, Gray, Blue

ships-from

United States, SPAIN, France, China

Batteries Included

No

Origin

Mainland China

1 review for Universal Mobile Phone Cooling Fan Radiator Semiconductor Phone Cooler Game Mini Cool Heat Sink For IPhone Samsung Xiaomi

  1. Username

    Review

Add a review

Your email address will not be published. Required fields are marked *